Overview
This project aimed to support Rolls Royce in the design of a of high temperature flexible PCB and through trials of flexible laminates manufactured from existing and brand new advanced polymers progress the temperature at which a flexible printed circuit can operate from the current state of the art maximum of 200°C into the desired range of 260°C (minimum) up to 400°C (target).
The project also aimed to develop the materials and manufacturing processes that enable this high temperature performance in a large format, such that the required overall length of 5m can be implemented in a single piece multilayer printed circuit, without joints.
Validation to TRL6 was achieved through coupon tests on representative hardware in a bespoke environmental chamber, subjecting the coupons to combined heat and random vibration loading, supported by full size PCBs integrated and tested at engine level.
Funding
Results
Executive Summary:
The objective of the SAGE3 was to develop and demonstrate a large 3-shaft bypass engine. The technological challenge was to increase the level of control on the engine core without the burden of heavy interconnection systems.
Flexible printed circuit boards had been considered as a replacement for conventional wire harnesses, in order to save weight, in order to save space – but both the high temperatures and the large engine size (requiring large, single piece, printed circuits) are potential barriers to implementation. Printed circuits are typically qualified for use up to 150C and are typically manufactured in lengths up to 610mm, exceptionally 914mm.
In this context, the LHTFPCB (Large High Temperature Flexible Printed Circuit) project aimed to support the end user in the design of a high temperature flexible PCB and, through trials of flexible laminates manufactured from advanced polymers, progress the temperature at which a flexible printed circuit can operate from the current state of the art maximum of 200°C into the desired range of 260°C (minimum) up to 400°C (target).
The project developed the materials and manufacturing processes that enable this high temperature performance in a large format, such that the required overall length of 5m can be implemented in a single piece multilayer printed circuit, without joints.