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Development of a readout circuit for a resonant accelerometer

European Union
Complete with results
Geo-spatial type
Total project cost
€795 630
EU Contribution
€596 723
Project Acronym
STRIA Roadmaps
Vehicle design and manufacturing (VDM)
Transport mode
Airborne icon
Transport policies
Transport sectors
Passenger transport,
Freight transport


Call for proposal
Link to CORDIS

The purpose of the project was to develop an ASIC implementing a readout interface for a resonant accelerometer. It was developed in response to the requirements described in the Clean Sky call for proposals referenced under CS-2012-01-SFWA-01-046 and the specifications the topic manager provided at the beginning of the project. Resonant accelerometers offer the advantage over capacitive ones to be less sensitive to radiations, which makes them ideal candidates for harsh environments applications. Whereas capacitive accelerometers exploit the change of capacitance of an element such a MEMS when it is subject to acceleration, resonant accelerometers detect the shift of the resonant frequency of a device when it is subject to acceleration.

The consortium was composed of two partners, CSEM and HMT, which both have a long track record in the design of integrated circuits apart from having complementary expertise, covering all the aspects of the project. CSEM has a recognized experience in low power and low voltage design of analogue and digital circuits, as well as wide competencies in the design of complex System-on-Chip (Soc). HMT is specialized in "mixed signal" ASICs and modules, particularly for sensors and actuators in highly demanding fields.


Parent Programmes
Institution Type
Public institution
Institution Name
European Commission
Type of funding
Public (EU)
Specific funding programme
JTI-CS - Joint Technology Initiatives - Clean Sky
Other Programme
JTI-CS-2012-1-SFWA-01-046 MEMS Accelerometer – Miniaturisation of the analogue electronics in an Asic


Executive Summary:

The goal of this project was the development of an ASIC to interface a resonant MEMS developed by Thales in order to miniaturize, reduce power consumption and reduce cost of a system offering inertial grade performances.

The consortium built to develop this ASIC is composed of CSEM and HMT. They both come from Switzerland, with strong R&D and industrialization experience in the area of high-performance ASICs, and already having experience working together on innovative sensor-ASIC projects and products.

The ASIC developed within the project incorporates the main functions to drive the resonant MEMS:

  • A main oscillation loop implemented by a transimpedance amplifier, a variable gain and a MEMS driver.
  • A secondary amplitude control loop which fixes the level of the sensed signals.
  • A damping loop built with another transimpedance amplifier, a bandpass filter and an output buffer, to damp the mechanical energy of the proof mass.
  • A digital block incorporating configuration registers as well as counters to digitize the acceleration measurement based on a counting scheme. It also incorporates a serial interface (SPI) to communicate with an external device.
  • Different peripheral blocks.

The ASIC is realised in a 350 nm process with high voltage options, as voltages in excess of 10 V are required for the damping of the proof mass. A first version was integrated and characterized.

This ASIC enables the reduction of the volume and power consumption of high performance resonant accelerometers, opening the door for the widespread dissemination of such products throughout the avionics field, and especially for integrated flow and load control systems as applied to the wings of civil aircraft.

The first generation of the ResAcc ASIC was realised within the scope of the ResAcc project on a multi-project wafer run. This ASIC demonstrated satisfactory functional, noise and temperature stability performance and also served as a proof of concept for the system including the MEMS. Problems with the ASIC are, however, observed due to packaging parasitics, amplitude control, and gain mismatch between design and measurement.

A second generation ResAcc ASIC was planned during the project. Due to the increased effort required to develop the first generation, and various delays this was not possible before the end of the project. The project partners are, however, continuing to develop the second generation ASIC, with which we expect to solve the observed issues.


Lead Organisation
Csem Centre Suisse D'electronique Et De Microtechnique Sa - Recherche Et Developpement
Rue Jaquet Droz 1, 2002 Neuchatel, Switzerland
EU Contribution
€440 798
Partner Organisations
Hmt Microelectronic Ag
ALFRED AEBI STRASSE 75, 2503 BIEL, Switzerland
Organisation website
EU Contribution
€2 154 936
Hmt Microelectronic Ag
ALFRED AEBI STRASSE 75, 2503 BIEL, Switzerland
Organisation website
EU Contribution
€155 925


Technology Theme
Sensor technologies
Integrate MEMS-based sensors and a RFID tag
Development phase
Demonstration/prototyping/Pilot Production

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