Skip to main content
European Commission logo
TRIMIS

High density power electronics for FC - and ICE - Hybrid Electric Vehicle Powertrains

PROJECTS
Funding
European
European Union
Duration
-
Status
Complete with results
Geo-spatial type
Other
Total project cost
€4 093 000
EU Contribution
€2 398 000
Project Acronym
HOPE
STRIA Roadmaps
Transport electrification (ELT)
Vehicle design and manufacturing (VDM)
Transport mode
Road icon
Transport policies
Digitalisation
Transport sectors
Passenger transport,
Freight transport

Overview

Call for proposal
FP6-2004-HYDROGEN-1
Link to CORDIS
Background & Policy context

The project HOPE addressed power electronics. It was based on previous EU research projects such as FW5 HIMRATE (high-temperature power modules), FW5 PROCURE (high-temperature passive components), and MEDEA+ HOTCAR (high-temperature control electronics) and other EU and national research projects.

Objectives

The general objectives of HOPE were:

  • cost reduction;
  • meet reliability requirements;
  • reduction of volume and weight.

This was a necessity to bring the FC- and ICE-hybrid vehicles to success.

Methodology
  • Definition of specifications common to OEM for FC- and ICE-hybrid vehicle drive systems; Identification of common key parameters (power, voltage, size) that allows consequent standardisation; developing a scalability matrix for power electronic building blocks PEBBs. The power ranges were much higher than those of e.g. HIMRATE and went beyond 100 kW electric power.
  • Preparation of works out one reference mission profile to be taken as the basis for the very extensive reliability tests planned.
  • Investigation of key technologies for PEBBs in every respect: materials, components (active Si- and SiC switches, passive devices, sensors), new solders and alternative joinings, cooling, and EMI shielding.
  • Development of three PEBBs: HDPM (high density power module) based on double side liquid cooling of the power semiconductor devices; IML (power mechatronics module) based on a lead-frame technology; and SiC-PEBB inverter (silicon carbide semiconductor JFET devices instead of Si devices).
  • Development of a control unit for high-temperature control electronics for the SiC-PEBBs. Finally WP6 works on integrating the new technologies invented in HOPE into powertrain systems and carries out a benchmark tests.

Funding

Parent Programmes
Institution Type
Public institution
Institution Name
European Commission
Type of funding
Public (EU)

Results

The results of HOPE are relevant from a business perspective because they improve the competitiveness of European products. On the other hand they help in meeting the environmental targets and therefore HOPE is relevant for the whole European society.

The project has the following deliverables :

  • common specifications from OEMs including key parameter ranges for FC-hybrid and ICE-hybrid vehicles drive system;
  • scalability matrix;
  • reference mission profile for FC- and ICE-hybrid electric vehicles;
  • applicable test procedures for power electronic systems;
  • results of APCT, AMPCT and subsystem tests;
  • sensor evaluation;
  • HT-joining technologies;
  • cooling concepts and verifications;
  • results of environmental and reliability tests;
  • design of the first mechatronic test vehicles;
  • SiC - control board;
  • HT - SiC control board;
  • impacts of implemented technologies on inverter integration;
  • benchmark study.

In summary it can be said that HOPE has achieved good progress:

Performance: There are many examples where the performance has been increased, like:

  • Thinner die attach to lower the thermal resistance
  • Measures to reduce the CTE mismatch
  • Specific packaging to reduce on-state and switching losses in SiC inverters
  • Low Rth heatpipe coupling to the SiC inverter
  • High temperature driver circuit
  • Local heating by thermosyphon
  • Integrated SiC commutation cell with very high power density

Lower cost: Three examples demonstrate that lower costs can be achieved:

  • IML technology has the potential of 30% cost reduction by replacing the ceramic DCB by a plastic insulator
  • The high temperature control board has a potential of 50% costs saving in contrast
    to the ceramic substrate
  • Integration itself has a potential of 20 to 30% because chip area and other
    materials can be saved.

Reliability: Improvements were made in the following areas:

  • Partially implementation of the new “Robustness Validation “ process
  • Methodology like the mission profile test
  • Translation of drive cycle to stress profile at the weakest parts of a system
  • Robust high temperature test equipment

Partners

Lead Organisation
Organisation
Siemens Ag
Address
Wittelsbacherplatz 2, 80333 MUENCHEN, Germany
Organisation website
Partner Organisations
Organisation
Magna Steyr Engineering Ag & Co Kg
Address
Liebenauer Hauptstraße 317, 8041 Graz, Austria
EU Contribution
€0
Organisation
Valeo Electronique Et Systemes De Liaison
Address
5 AVENUE NEWTON, 78180 MONTIGNY LE BRETONNEUX, France
Organisation website
EU Contribution
€0
Organisation
Daimler Ag
Address
Epplestrasse 225, 70567 STUTTGART, Germany
Organisation website
EU Contribution
€0
Organisation
Eidgenoessische Technische Hochschule Zuerich
Address
Raemistrasse 101, 8092 ZUERICH, Switzerland
Organisation website
EU Contribution
€0
Organisation
Frauenhofer Geselschaft Zur Foerderung Der Angewandten Forschung E.v.
Address
Hansastrasse 27C, 80686 MUNCHEN, Germany
Organisation website
EU Contribution
€0
Organisation
Institut National De La Recherche Sur Les Transports Et Leur Securite
Address
2 Avenue du General Malleret Joinville, 94114 ARCUEIL, France
Organisation website
EU Contribution
€0
Organisation
Robert Bosch Gmbh
Address
Robert-Bosch-Platz1, 10 60 50 STUTTGART, Germany
Organisation website
EU Contribution
€0
Organisation
Siemens Ag
Address
Wittelsbacherplatz 2, 80333 MUENCHEN, Germany
Organisation website
EU Contribution
€0
Organisation
Volkswagen
Address
Berliner Ring 2, 1894 WOLFSBURG, Germany
Organisation website
EU Contribution
€0
Organisation
Universite De Technologie De Belfort - Montbeliard
Address
Site De Belfort, 2Eme Etage, 90010 Belfort, France
EU Contribution
€0
Organisation
Politechnika Warszawska
Address
Plac Politechniki 1, 00 661 Warszawa, Poland
Organisation website
EU Contribution
€0
Organisation
Renault Represented By Gie Reginov
Address
Quai Alphonse Le Gallo 13/15, 92100 BOULOGNE-BILLANCOURT, France
Organisation website
EU Contribution
€0
Organisation
Valeo Etudes Electroniques Sas
Address
Avenue Fernand Pouillon, 2, CRÉTEIL, France
EU Contribution
€0
Organisation
Continental Ag
Address
Vahrenwalder Strasse 9, 169 HANNOVER, Germany
Organisation website
EU Contribution
€0

Technologies

Contribute! Submit your project

Do you wish to submit a project or a programme? Head over to the Contribute page, login and follow the process!

Submit