Sorry, you need to enable JavaScript to visit this website.
English (en)
TRIMIS

Innovative COoling system for embedded Power Electronics

ICOPE

Innovative COoling system for embedded Power Electronics

Call for proposal: 
H2020-CS2-CFP04-2016-02
Link to CORDIS:
Objectives: 

The main goal of this project is the design of innovative and efficient air cooled heat sinks to cool the power electronics modules that are a key component of the more electrical aircraft power management centre design. The new design is expected to be developed in two stages:

  1. The first one should be covered by the implementation of Annealed Pyrolytic Graphite (APG) and folded brazed fins
  2. In the second stage the integration of Metal Matrix Composites (MMC) is expected

The final target of the development is the reduction of weight of the whole power management system (bay integrating four heat sinks), while maintaining an efficient and reliable cooling.

Coming from advances in the power semiconductors field, by the use of high-temperature and more efficient materials such as Silicon Carbide (SiC) and Gallium Nitride (GAN), the thermal management strategy could take into consideration the implementation of air cooled solutions, which are expected to reduce the overall weight comparing to liquid or two-phase flow solutions, while also adding some benefits in terms of reliability and maintenance aspects.

Institution Type:
Institution Name: 
European Commission
Type of funding:
Lead Organisation: 

Universitat Politecnica De Catalunya

Address: 
Calle Jordi Girona 31
8034 Barcelona
Spain
EU Contribution: 
€209,300
Partner Organisations: 

Aavid Thermacore Europe Limited

Address: 
Wansbeck Business Park 12
Ashington
NE63 8QW
United Kingdom
EU Contribution: 
€511,648

Schunk Carbon Technology Gmbh

Address: 
AU 62
4822 BAD GOISERN
Austria
EU Contribution: 
€65,217
Technologies: 
Development phase: