Several routes of applied research will be developed on nanostructured TE modules combining different fabrication processes, all industry-scalable (sputtering, atomic layer deposition, nanocomposite), materials (Bi2Te3, perovskite, metal-oxides, skutterudite) and “nano-approaches” (superlattices, nanoinclusions)

Innovative packaging and integration solutions, allowing the integration of the nano-TE materials into highly efficient modules (high CoP) at the core of the system-level demonstrators.

Innovative applied research on integration, packaging and interconnect technologies will be developed to guarantee the high efficiency of the TE modules and ensure the short time to market implementation of the project results. To satisfy different end-user needs, different packaging concepts (internal or external TEC integration), geometries, Thermal Interface Materials, underfilling and interconnect technologies will be developed in complete accordance to each demonstrator specifications.

The NANOTEG consortium (21 partners from 9 European ENIAC-member States) gathers all the competences required to achieve these objectives. It is well balanced and involves all the supply chain partners in order to anticipate the cost-effective introduction of these new technologies and future products on the market.