PRIMES has been created as a legal and independent entity, inheriting the successful experience of PEARL Laboratory. This has allowed to give to the structure a wide and strong international visibility as one of the best European technological platform specialized in power integration.

PRIMES puts a huge effort in developing virtual model solutions for power electronics components and systems, combined to a prototyping and characterization platform to be able to design, simulate, manufacture and characterize new power module technological demonstrators at the same place.

PRIMES bondwire-less technology with double-sided semiconductor cooling has been demonstrated for high power devices. Such technology is centred on the use of bumps for connecting the surface side of vertical power components and enables a significant improvement in power density as compared with standard IGBT modules. Chips interconnection is ensured by flat substrates both on the bottom and on the top side; additional bumps are inserted on the sides of the structure to enhance mechanical stiffness and reduce stress at device level; after proper insulation, the structure is apt for double-sided cooling, with improved performance of the semiconductor devices.

The results of the project will be produced under license by the aPSI3D start-up, created in order to have a European manufacturer able to produce specific integrated power modules.

The results will be protected by patents or disseminated through international conferences and publications.