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TRIMIS

Advanced Sensors and Novel Concepts for Intelligent and Reliable Processing in Bonded Repairs

Project

SENARIO - Advanced Sensors and Novel Concepts for Intelligent and Reliable Processing in Bonded Repairs


Funding origin:
European
European Union
STRIA Roadmaps:
Vehicle design and manufacturing (VDM)
Vehicle design and manufacturing
Transport infrastructure (INF)
Transport infrastructure
Transport mode:
Airborne
Airbone
Transport sectors:
Passenger transport
Passenger transport
Freight transport
Freight transport
Duration:
Start date: 01/01/2007,
End date: 01/12/2009

Status: Finished
Funding details:
Total cost:
€2 922 511
EU Contribution:
€1 976 379

Overview

Background & policy context:

The main limitation of the existing technology in bonding repair of aerospace structures lies in the inability of the repair control systems to assess the actual material state and integrate the available tools (simulations, measurements, experience and knowledge) into an intelligent material-based control system.

To circumvent these limitations, the SENARIO project proposed the development of a revolutionary sensing system linked to intelligent process control equipment and reliable methodologies of aero structures component maintenance.

Objectives:

The proposed system consisted of:

  • a portable curing process console with blanket-mounted dielectric sensors;
  • wireless non-intrusive dielectric sensors for monitoring adhesive state;
  • reliable laser technology for increased automation;
  • optical sensors complementing the dielectric sensors;
  • thermo mechanical monitoring set-up;
  • intelligent process guidance system for co-cured components;
  • integrated multi-zone repair control unit, and;
  • application of bonded repairs with reliability, controlled quality and certification potential.

Methodology:

The proposed novel multi-zone integrated process control scheme gains full benefit from the use of multi-sensory devices and the deployment of existing process knowledge (cure and stress development). The scheme enables in situ monitoring of bonded repair and resulting adhesion quality through the repair process, while offering a potential tool for non-intrusive structural health monitoring.

The main innovations reside in:

  • the use of durable dielectric sensors in the repair process for real-time assessment of in-patch conditions;
  • the wire-free dielectric sensor capable of measuring remotely changes in adhesive electrical properties;
  • intelligent process guidance algorithm for optimal repair process conditions in co-curing applications;
  • the interface between thermomechanical process simulation tools, process actuators and composites multi-sensory monitoring tools.

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